Благодаря Всъщност разбрах всичко.
И накрая намерих следното, конкретно за ЛМ317Т:
Heatsinking an LM317T:
An LM317T can safely be used to dissipate up to 0.25 Watts without any external heatsinking.
Note that the absolute maximum dissipation rating for an LM317T is 15 Watts.
И още по-добре обяснено с всичките формули:
HEATSINK REQUIREMENTS
The LM317 regulators have internal thermal shutdown to protect
the device from over-heating. Under all operating conditions,
the junction temperature of the LM317 should not
exceed the rated maximum junction temperature (TJ) of 150°
C for the LM117, or 125°C for the LM317A and LM317. A
heatsink may be required depending on the maximum device
power dissipation and the maximum ambient temperature of
the application. To determine if a heatsink is needed, the
power dissipated by the regulator, PD, must be calculated:
PD = ((VIN − VOUT) × IL) + (VIN × IG) (3)
Figure 4 shows the voltage and currents which are present in
the circuit.
The next parameter which must be calculated is the maximum
allowable temperature rise, TR(MAX):
TR(MAX) = TJ(MAX) − TA(MAX) (4)
where TJ(MAX) is the maximum allowable junction temperature
(150°C for the LM117, or 125°C for the LM317A/LM317), and
TA(MAX) is the maximum ambient temperature which will be
encountered in the application.
Using the calculated values for TR(MAX) and PD, the maximum
allowable value for the junction-to-ambient thermal resistance
(θJA) can be calculated:
θJA = (TR(MAX) / PD) (5)
If the calculated maximum allowable thermal resistance is
higher than the actual package rating, then no additional work
is needed. If the calculated maximum allowable thermal resistance
is lower than the actual package rating either the
power dissipation (PD) needs to be reduced, the maximum
ambient temperature TA(MAX) needs to be reduced, the thermal
resistance (θJA) must be lowered by adding a heatsink,
or some combination of these.
If a heatsink is needed, the value can be calculated from the
formula:
θHA ≤ (θJA - (θCH + θJC)) (6)
where (θCH is the thermal resistance of the contact area between
the device case and the heatsink surface, and θJC is
thermal resistance from the junction of the die to surface of
the package case.
When a value for θ(H−A) is found using the equation shown, a
heatsink must be selected that has a value that is less than,
or equal to, this number.
The θ(H−A) rating is specified numerically by the heatsink manufacturer
in the catalog, or shown in a curve that plots temperature
rise vs power dissipation for the heatsink.